By John H. Lau ... [et al.]

Advent to MEMS --
Advanced MEMS packaging --
Enabling applied sciences for complex MEMS packaging --
Advanced MEMS wafer-level packaging --
Optical MEMS packaging : communications --
Optical MEMS packaging : bubble swap --
Optical MEMS : microbolometer packaging --
Bio-MEMS packaging --
Biosensor packaging --
Accelerometer packaging --
Radiofrequency MEMS switches --
RF MEMS tunable capacitors and tubable band-pass filters --
Advanced packaging of RF MEMS units

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Extra info for Advanced MEMS packaging, Edition: English

Sample text

19. “MEMS device with integral packaging,” Cohn, Michael B. (US), Xu, Ji-Hai (US), US2008272867 (A1)—2008-11-06. 20. “Packaged MEMS device assembly,” Haluzak, Charles C. (US), Pollard, Jeffrey R. (US) (+5), US2008272446 (A1)—2008-11-06. 21. “MEMS device airtightness packaging method,” Chen, Jing (CN), Wu, Yexian (CN) (+1), CN101234745 (A)—2008-08-06. 22. “Orientation-dependent etching of deposited AIN for structural use and sacrificial layers in MEMS,” Bouche, Guillaume (US), Wall, Ralph N. (US), US2008268575 (A1)—2008-10-30.

US), Curtis, Harlan L. (US), SG132638 (A1)—2007-06-28. 65. “Condenser microphone and packaging method for the same,” Song, Chung-Dam, SG131039 (A1)—2007-04-26. 66. “Silicon based condenser microphone and packaging method for the same,” Song, Chung-Dam, SG130158 (A1)—2007-03-20. 67. “Desiccant in a MEMS device,” Palmateer, Lauren (US), WO2007136706 (A1)—2007-11-29. 68. “Semiconductor device having microstructure and method of manufacturing microstructure,” Ikeuchi, Naoki (JP), Hashimoto, Hiroyuki (JP), US2007262306 (A1)—2007-11-15.

Capacitance type micro-accelerometer,” Liu, Minjie (CN), Liu, Yunfeng (CN) (+2), CN101271125 (A)—2008-09-24. 17. “Silicon piezoresistance type pressure transducer encapsulation structure based on substrates,” Wang, Yuelin (CN), Wu, Yanhong (CN) (+2), CN101271029 (A)—2008-09-24. 18. “MEMS device support structure for sensor packaging,” Ahmad, Nazir (US), US2008277747 (A1)—2008-11-13. 19. “MEMS device with integral packaging,” Cohn, Michael B. (US), Xu, Ji-Hai (US), US2008272867 (A1)—2008-11-06.

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